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Copper pillar, copper post, copper column

Stable supply of high-precision micro terminals and micro pins is possible!

FineNex manufactures and sells Cu pillars with diameters ranging from 60μm to several hundred μm, intended for narrow pitch mounting in 2.5D and 3D packages. Utilizing our own equipment and molds, we achieve high-precision processing technology that ensures stable dimensional accuracy, enabling production capabilities of hundreds of millions to billions of units per month. Leveraging our long-standing experience in manufacturing micro terminal pins, we can provide a stable supply of high-precision micro terminals and micro pins that can be used as copper pillars, copper posts, and copper pins. 【Features】 ■ Expected to be used as interconnects for embedded substrates and pins for interposers in semiconductor packages with POP structures used for high-speed communication. ■ Arranging micro-diameter copper pins in a cylindrical post shape to accommodate narrower pitches. ■ Providing electrical connections as interconnects for semiconductor chips and packages, as well as interposers. ■ Achieving narrow pitch while allowing for free design in the height direction. ■ Strengthening bonding strength by transitioning from point contacts to surface contacts. *For more details, please refer to the related links or feel free to contact us.

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